Reliable bonding films for structural integrity & multi-material assemblies.
Danutec´s precise areal weight and scrim supported adhesive film with intrinsic toughening offer perfect adhesion to core, metal and hybrid materials. Excellent lap shear and peel strength together with exact bond line thicknesses are offering significant advantages to manually applied paste adhesives.
All adhesive films are fully compatible with Danutec´s prepreg and semi-preg products, supporting low temperature cycles with low exothermicity as well as snap curing applications and are available in areal weights from 150 to 400 gsm. An easy handling mode including smooth cutting and layup procedures saves cycle times compared to conventional adhesive mixing and application.
A toughened epoxy film adhesive for medium temperature curing, supported to ensure consistent bond-line thickness, broad substrate compatibility
Cured Tg | 125-135°C |
Process | Autoclave, Prepreg Compression Moulding |
Key attributes | Low tack for improved handling, fast cure capable |
Outlife | 3 weeks at RT |
Markets | Automotive, General Industrial |
Modified epoxy adhesive film for low temperature curing, supported to ensure consistent bond-line thickness, high lap shear performance
Cured Tg | 95-105°C |
Process | Autoclave, OutOfAutoclave |
Key attributes | Broad substrate compatibility, enhanced tack, fully compatible with VIE and BUD prepregs |
Outlife | 8 weeks at RT |
Markets | Marine, Defense, General Industrial, Wind Energy |
